Tuesday, July 14, 2009

ESI Buys IC Packaging Technology From Bankrupt Firm

Portland-based Electro Scientific Industries reports this morning that the firm has acquired the thin wafer dicing and TSV drilling intellectual property rights of Xsil, a provider of laser-machined tools for the MEMs and semiconductor packaging industry. Financial terms were not disclosed. According to ESI, the acquisition will bolster its technology for 3D IC packaging and memory repair product applications. The assets were acquired by ESI out of bankruptcy.