Tuesday, March 1, 2016

Inpria Inks Funding Round

Corvallis, Oregon-based Inpria, a developer of semiconductor manufacturing technology, has scored a funding round from Air Liquide Venture Capital (ALIAD), Samsung Venture Investment Corporation and Intel Capital, plus Tokyo Ohka Kogyo (TOK), the company said this morning. The startup, which is developing a metal oxide photoresist technology--used as a key part of the semiconductor manufacturing process--said the funding goes towards development and scaling up manufacturing. Size of the round was not announced, however, the company said the funds doubles the company's total financing to date. Inpria is led by Andrew Grenville. More information »