Friday, July 11, 2008

NexPlanar Takes $14.5M For Semiconductor Tech

Hillsboro, Oregon-based NexPlanar Corporation said late Thursday that it has completed a $14.5M round of funding for its semiconductor technology. The round was led by InterWest Partners, and included prior investors BlueRun Ventures, Smart Forest Ventures, Fina Ventures, Intel Capital, and Entegris. NexPlanar develops chemical mechanical planarization (CMP) pad technology, used in the semiconductor device manufacturing process. CMP is used in the semiconductor industry for preparing semiconductor wafers before masking on chips; the process ensures that semiconductor wafers are flat, or polished before photolithography. More information »